PCB FABRICATION
RIDGID MULTILAYER PCBs
Assembling Printed Circuit Boards for prototype and mass volume production is a specialty for AQS. Our team can support NPI prototypes to mass production. We are flexible in modifying PCB’s to your exact qualification whether it is single or complex multiple layered boards, we have the solution to all PCBA needs. Our state of the art technology and global facilities give us the capabilities to take on any volume of work. Key technical milestones at AQS include:
- Double-sided and multilayer rigid boards
- High-layer-count constructions and large-format backplanes
- Controlled impedance and low-loss materials for high-speed signals
- Blind and buried vias, backdrilling, and multiple sequential laminations
HDI and ADVANCED VIA TECHNOLOGIES
High-density interconnect technology supports fine-pitch components and dense routing. Available microvia and build-up structures are selected for the design’s electrical performance and manufacturing requirements.
- Polyimide materials and adhesive or adhesiveless constructions
- Coverlays and stiffeners
- Bookbinder constructions for complex flex sections
FLEX and RIDGID FLEX PCBs
Flexible and rigid-flex circuits support compact packaging and connections between rigid board sections. Available constructions include single-sided, double-sided, and multilayer flex, as well as multilayer rigid-flex with HDI features.
- Polyimide materials and adhesive or adhesiveless constructions
- Coverlays and stiffeners
- Bookbinder constructions for complex flex sections
RF and MICROWAVE PCBs
RF and microwave applications require fabrication processes and materials suited to high-frequency performance. AQS offers specialty boards using low-loss laminates, controlled impedance, and mixed-material constructions.
- PTFE and other specialty RF laminates
- Hybrid stack-ups combining RF and conventional materials
- Precision features and interconnects for high-frequency designs
- Stack-up and manufacturability review
THERMAL MANAGEMENT PCBs
- Heavy copper constructions
- Insulated metal substrates and metal inlays
- Embedded copper coins and other coin-based thermal solutions
- Thermal via structures and copper-filled features
SURFACE FINISHES AND BARE BOARD TESTING
- Netlist electrical testing and flying probe testing
- Automated optical inspection
- TDR impedance verification and impedance coupons
- Microsections, thermal stress, and solderability testing when specified
ONE STOP FABRICATION and ASSEMBLY
Combine bare-board fabrication with AQS component procurement, PCB assembly, testing, and box build services. Coordinating fabrication and assembly through AQS simplifies purchasing and helps align panelization, board finish, and documentation with the assembly process. We support prototype, high-mix and low-volume, NPI, and production requirements. Fabrication schedules and technical requirements are reviewed for each project.
SELECTED ADVANCED FABRICATION CAPABILITIES
Availability and achievable combinations depend on material, stack-up, copper weight, and board geometry. Final requirements and lead times are confirmed during quotation.
Request a PCB Fabrication Quote
Contact AQS for bare-board fabrication or a combined fabrication and assembly quote. Tell us your required quantities, target delivery date, and any special technology or quality requirements.
For an accurate quotation, provide your released fabrication drawing, Gerber or ODB++ data, drill files, stack-up, material and copper requirements, surface finish, and impedance requirements. Include the applicable acceptance class and any required testing, certifications, or source restrictions.
For controlled technical data, contact AQS to arrange the appropriate transfer method before submitting files.
Email contact: info@aqs-inc.com